CARAC, is the annual event dedicated to characterization techniques that fit to electronics domain and beyond. CARAC 2024 titled “An expert Marathon: PAC-G” is an exclusive virtual event dedicated to addressing real-world challenges in materials characterization, specifically for the semiconductor and electronics industries. This year CARAC is led by IRT Nanoelec featuring contributions from our esteemed partners - European Synchrotron Radiation Facility (ESRF), Institut Laue Langevin (ILL), Laboratory of Subatomic Physics and cosmology (CNRS-LPSC) and the Alternative Energies and Atomic Energy Commission (CEA Leti - PFNC), the Néel Institute, Grenoble-INP/UGA, and SERMA Technologies.
The characterization of new electronic components is vital for ensuring their design, reliability and performance. As technologies evolve under the More-than-Moore approach, the demand for advanced characterization methods becomes critical. Conventional lab equipment often falls short in correlating micro and nanoscale material characteristics with macroscopic properties, which is where CARAC comes to play.
The CARAC 2024 event aims to facilitate expert-led Q&A sessions focused on current industry challenges in materials characterization using the PAC-G’s state of the art non-destructive physical and chemical characterization, imaging, irradiation and analytical techniques that visualize the defects, reliability and performance of electronic components.
This event offers an exceptional opportunity for academia-industry collaboration, fostering partnerships that drive innovation in Micro and Nano-electronics sector. Attendees will leave with practical, actionable knowledge and connections to techniques tailored to their R&D needs. We invite you to join us and be part of this vital conversation in advancing materials characterization.
Schedule:
• General Presentation:
A focused overview of how synchrotron X-rays and neutron-based methodologies are revolutionizing the semiconductor industry by allowing detailed analysis of material properties at the atomic and nanometric scale.
• Interactive Q&A Sessions:
Participants will have the opportunity to engage with PAC-G experts in dedicated 20-minute sessions covering the following topics:
o Non-destructive analysis and failure analysis using synchrotron X-ray and neutron imaging.
o Crystal quality assessment through X-ray topography techniques.
o High-resolution mapping of residual stress in microelectronic devices.
o Radiation hardness testing methodologies using neutron and X-ray techniques.
o Open topic Q&A requested by the participant.
• On Demand Virtual Tour:
Participants will have the opportunity to demand a virtual tour of PAC-G’s supported beamlines at the ESRF and ILL
